Enzotech BMR-C1 High Profile Ramsinks

Enzotech's BMR-C1 BGA Ramsinks are designed to offer exceptional heat dissipation for BGA memory chips on video cards and motherboards. BMR-C1 RAM sinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The BMR-C1 RAM Sink is far superior to traditional heat sinks currently found on the market and provides the best thermal conductivity available to dissipate heat from RAM in your system.

Features:
ATI® & NVIDIA® Compatible
Pure forged copper
Easy installation by using 3M™ 8815 Thermal Tape
Multipack - Eight (8) piece set

Specifications:
Dimensions (mm)  14(L) mm x 14mm(W) x 14mm(H)
Material  C1100 Forged Copper
Weight  7g (Each)
Thermal Adhesive  3M™ 8815 Thermal Tape